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:: Shapal™ Hi-M Analysis ::

Comparison of Shapal™-M soft with Shapal™ Hi-M soft and traditional ceramics

This information is provided to help existing users of Shapal™-M soft compare it with the new Shapal™ Hi-M soft material and also to help users of traditional ceramics evaluate this machineable ceramic for their application.

Comparison of flexural strengths and thermal conductivities (Typical Data)

Data Supplied by Tokuyama Corporation, Tokyo, Japan


Element Shapal™-M soft Shapal™ Hi-M soft
 C  300ppm 300ppm
Ca 450ppm 1300ppm
Cr 60ppm 1ppm
Mg 15ppm 1ppm
Ni <5ppm 2ppm
Fe 20ppm 8ppm
Si <15ppm 40ppm
O 0.5% 0.9%
Ti <1 <20
Property/Test Conditions Shapal™-M soft Shapal™ Hi-M soft Units
Density Corrected to 4°C 2.88 2.88 g/cm³
Porosity 25°C 0 0 %
Volume Resistivity 25°C, DC 1.4 x 1012 1.0 x 1015 Ωcm 
Dissipation Factor (tan δ) 25°C, 1MHz 9.1 x 10-4 10 x 10-4  
Dielectric Constant (ε) 25°C, 1MHz 6.9 6.8  
Dielectric Strength
56 65 kV/mm
Thermal Expansion Coefficient RT~400°C 4.4 x 10-6 4.8 x 10-6 /°C
Thermal Expansion Coefficient RT~600°C 4.8 x 10-6 4.9 x 10-6 /°C
Thermal Expansion Coefficient RT~800°C 5.1 x 10-6 5.0 x 10-6 /°C
Thermal Conductivity 25°C 96 92 W/mK
Maximum Use Temp. (in air) 1,000 1,000 °C
Maximum Use Temp (in nonoxidizing atmosphere) 1,900 1,900 °C
Thermal Shock Resistance ∆t water quench 400 400 °C
Bending Strength 25°C 273 300 MPa 
Compressive Strength 25°C 120 100 kg/mm2
Young's Modulus 25°C 1.9 x 104 1.8 x 104 kg/mm2
Poisson's Ratio 25°C 0.31 0.31  
Vickers Hardness (Hv) 25°C, 300g 390 380 kg/mm2
Resistance to Acid 10%HCI 24Hrs, 25°C 0.2 0.2 mg/cm2 wt loss
Resistance to Base 10%NaOH 24Hrs, 25°C 60 60 mg/cm2 wt loss

Note:  Shapal™ is a registered trademark of Tokuyama Corporation, Tokyo, Japan